PART |
Description |
Maker |
SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
TQFN4X4-24 |
Package Outline
|
Global Mixed-mode Techn...
|
LQFP44 |
Package outline
|
Philips
|
WLCSP3X3-5 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-28 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP8X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|
TSSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|